HTSX35SL

HTSX is a silicone thermal interface material (TIM) which has been developed to perform in more extreme conditions than its sister product HTS. It exhibits extended characteristics to HTS, with higher thermal conductivity, extended operating temperatures and excellent stability with a much-reduced oil bleed. It is a non-curing thermal paste, making it easy to apply and easy to rework if necessary. It is ideal for use on heatsinks or between components to dissipate heat away from the electronic device and can be used in a wide range of industry applications. As with any thermal interface material, we would recommend testing before selecting as the TDS figures and performance of the product may vary depending on the individual application. If you have any questions, or require any assistance with selecting the right material, please free to contact our technical support team.

• General purpose silicone thermal paste
• Reduced oil-bleed
• Non-curing thermal paste
• Excellent stability in a range of conditions
• Exceptionally wide operating temperature range
• Excellent thermal conductivity
• Allows simple and efficient rework of components if required
• RoHS-2 Compliant